Load lock type EB evaporation deposition device
Reduction of particles through suitable surface treatment! Compatible with high vacuum processes using a load-lock system.
The "Load Lock Type EB Evaporation Device" achieves excellent film thickness distribution and reproducibility through substrate rotation. It supports high vacuum processes using a load lock system, as well as lift-off processes and tray transport. It is capable of high-temperature processes up to 900°C, and maintenance of the chamber is easy. Please feel free to contact us when needed. 【Features】 ■ Capable of high-temperature processes up to 900°C ■ Achieves excellent film thickness distribution and reproducibility through substrate rotation ■ Supports high vacuum processes with a load lock system ■ Reduces particles through suitable surface treatment ■ Easy maintenance of the chamber *For more details, please refer to the PDF materials or feel free to contact us.
- Company：ジャパンクリエイト
- Price：Other
